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NCT1008
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19
PACKAGE DIMENSIONS
WDFN8 2x2, 0.5P
CASE 511AT01
ISSUE O
C
A
SEATING
PLANE
D
E
0.10
C
A3
A
A1
0.10
C
DIM
A
MIN
MAX
MILLIMETERS
0.70
0.80
A1
0.00
0.05
A3
0.20 REF
b
0.20
0.30
D
E
e
L
PIN ONE
REFERENCE
0.05
C
0.05
C
A
0.10
C
NOTE 3
L2
e
b
B
4
8
8X
1
5
0.05
C
L1
2.00 BSC
2.00 BSC
0.50 BSC
0.40
0.60
---
0.15
BOTTOM VIEW
L
7X
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPD
EXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL B
DETAIL A
L2
0.50
0.70
B
TOP VIEW
SIDE VIEW
NOTES:
1.  DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2.  CONTROLLING DIMENSION: MILLIMETERS.
3.  DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
2X
2X
8X
e/2
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.30
0.50
0.78
7X
DIMENSIONS: MILLIMETERS
0.30
PITCH
8X
1
PACKAGE
OUTLINE
RECOMMENDED
0.88
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